1 Multilayer Fiber-Reinforced Circuit Board +
3 Crystalprocessor Assembly +
2 SMD Diode +
4 NOR Memory Chip +
4 Random Access Memory Chip +
6 Fine Niodium-Titanium Wire +
Molten Lead - 576L или
Molten Tin - 288L или
Molten Soldering Alloy - 144L